Solutions for electronics
InnoLas Solutions develops highly efficient machine solutions for electronics production from innovations in laser technology. The use of ultrashort pulse lasers ensures optimum processing results when drilling, scribing, cutting and structuring PCB materials, ceramic substrates and semiconductor wafers.
Galvanometer scanners or fixed optics process heads can be combined in any machine. Two-stage processes can also be covered in one machine.
Printed circuit boards laser processing
Microvias drilling
Laser drilling of blind vias and through hole vias in rigid and flexible PCBs. Microvias with high aspect ratios and diameters < 20µm. Trepanning or percussion drilling with ultra-short pulse lasers for ideal process results in a wide variety of PCB materials.
Example: RCC, FR4, FR5, Polyimide
Cutting printed circuit boards
Laser cutting of contours (routing) in rigid/flexible PCBs and in cover foils. Clean and highly precise cuts with minimum cutting width in various PCB materials.
Example: RCC, FR4, PTFE, CEM, Polyimide
Depaneling
Laser cutting of assembled and unassembled printed circuit boards. Clean and highly precise cuts with minimum cutting width in various PCB materials.
Example: FR4, FR5, Polyimide
Structure printed circuit boards
Laser structuring of the copper top layer of printed circuit boards with minimal damage to the underlying material (dielectric). Creation of very fine structures < 10µm with high precision and repeatability.
Cavities in printed circuit boards
Targeted material removal with the laser allows cavities to be created in the printed circuit board into which microchips are inserted. The laser process allows precise control of the ablation depth and geometry of the cavity.
The use of suitable laser sources and processing strategies guarantees high surface quality with minimal thermal stress on the material.
Ceramic laser processing
Ceramic scribe
Laser scribing of ceramic substrates creates a defined fracture line in the material, which enables clean and precise separation into individual segments (singulation).
Depending on the application requirements and the laser source selected, the substrate is processed either with a fixed optics or a galvo scanner. Here, ultrashort pulse lasers generate burr-free scribe lines and reduce thermally induced material stresses through an almost cold ablation process.
Typical materials: AlOx, AlNi, DCB substrates, composite ceramics
Ceramic cutting
Laser cutting is used to create any geometries with minimal radii in ceramic substrates (internal and external contours). Depending on the application requirements and the laser source selected for this purpose, the substrate is processed either with fixed optics or a galvo scanner. Here, ultrashort pulse lasers generate burr-free scribe lines and reduce thermally induced material stresses through an almost cold ablation process.
Typical materials: AlOx, AlNi, LTCC, HTCC, DCB substrates, composite ceramics
Keramik bohren
Laser drilling of ceramic substrates enables smallest hole diameters (<40µm). Depending on the hole diameter, ideal hole geometries are created in AlOx, AlNi, LTCC, HTCC, DCB substrates and composite ceramics by trepanning or percussion drilling.
Ultrapulse lasers produce burr-free holes here and reduce thermally induced material stresses through a nearly cold ablation process.
Erzeugung von Kavitäten in Keramik
Targeted material ablation with the laser allows cavities to be created in ceramic substrates into which microchips are inserted. The laser process allows precise control of the ablation depth and geometry of the cavity.
The use of suitable laser sources with pulse lengths in the nanosecond and picosecond range guarantees high surface quality with minimal thermal stress on the material.