Electronics

Solutions for electronics

InnoLas Solutions develops highly efficient machine solutions for electronics production from innovations in laser technology. The use of ultrashort pulse lasers ensures optimum processing results when drilling, scribing, cutting and structuring PCB materials, ceramic substrates and semiconductor wafers.

Galvanometer scanners or fixed optics process heads can be combined in any machine. Two-stage processes can also be covered in one machine.

Printed circuit boards laser processing

Microvias drilling

Laser drilling of blind vias and through hole vias in rigid and flexible PCBs. Microvias with high aspect ratios and diameters < 20µm. Trepanning or percussion drilling with ultra-short pulse lasers for ideal process results in a wide variety of PCB materials.

Example: RCC, FR4, FR5, Polyimide

More information about Microvias Drilling

Recommended machine types: LINEXO, EXPEGO

Cutting printed circuit boards

Laser cutting of contours (routing) in rigid/flexible PCBs and in cover foils. Clean and highly precise cuts with minimum cutting width in various PCB materials.

Example: RCC, FR4, PTFE, CEM, Polyimide

More information about laser cutting

Recommended machine types: DIVIDOS, EXPEGO, LINEXO

Depaneling

Laser cutting of assembled and unassembled printed circuit boards. Clean and highly precise cuts with minimum cutting width in various PCB materials.

Example: FR4, FR5, Polyimide

More information about depaneling

Recommended machine types: DIVIDOS, EXPEGO, LINEXO

Structure printed circuit boards

Laser structuring of the copper top layer of printed circuit boards with minimal damage to the underlying material (dielectric). Creation of very fine structures < 10µm with high precision and repeatability.

More information about structuring

Recommended machine types: LINEXO, EXPEGO, DIVIDOS

Cavities in printed circuit boards

Targeted material removal with the laser allows cavities to be created in the printed circuit board into which microchips are inserted. The laser process allows precise control of the ablation depth and geometry of the cavity.
The use of suitable laser sources and processing strategies guarantees high surface quality with minimal thermal stress on the material.

More information about creating cavities

Recommended machine types: LINEXO, EXPEGO, DIVIDOS

Ceramic laser processing

Ceramic scribe

Laser scribing of ceramic substrates creates a defined fracture line in the material, which enables clean and precise separation into individual segments (singulation).
Depending on the application requirements and the laser source selected, the substrate is processed either with a fixed optics or a galvo scanner. Here, ultrashort pulse lasers generate burr-free scribe lines and reduce thermally induced material stresses through an almost cold ablation process.

Typical materials: AlOx, AlNi, DCB substrates, composite ceramics

More information about scribing

Recommended machine types: LINEXO, EXPEGO, ULTAGO

Ceramic cutting

Laser cutting is used to create any geometries with minimal radii in ceramic substrates (internal and external contours). Depending on the application requirements and the laser source selected for this purpose, the substrate is processed either with fixed optics or a galvo scanner. Here, ultrashort pulse lasers generate burr-free scribe lines and reduce thermally induced material stresses through an almost cold ablation process.

Typical materials: AlOx, AlNi, LTCC, HTCC, DCB substrates, composite ceramics

More information about laser cutting

Recommended machine types: LINEXO, EXPEGO, ULTAGO

Keramik bohren

Laser drilling of ceramic substrates enables smallest hole diameters (<40µm). Depending on the hole diameter, ideal hole geometries are created in AlOx, AlNi, LTCC, HTCC, DCB substrates and composite ceramics by trepanning or percussion drilling.
Ultrapulse lasers produce burr-free holes here and reduce thermally induced material stresses through a nearly cold ablation process.

More information about laser drilling

Recommended machine types: LINEXO, EXPEGO, ULTAGO

Erzeugung von Kavitäten in Keramik

Targeted material ablation with the laser allows cavities to be created in ceramic substrates into which microchips are inserted. The laser process allows precise control of the ablation depth and geometry of the cavity.
The use of suitable laser sources with pulse lengths in the nanosecond and picosecond range guarantees high surface quality with minimal thermal stress on the material.

More information about creating cavities

Recommended machine types: LINEXO, EXPEGO, ULTAGO

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