Laser Direct Cleaving (LDC)
Cell cutting / Laser Direct Cleaving (LDC)
New cutting processes for crystalline silicon solar cells are constantly making their way into the PV market. One example is the innovative cell cutting technology Laser Direct Cleaving (LDC). The patented thermal separation process from InnoLas Solutions is guided by a laser beam and is a direct cleaving process.
LDC vs. „Scribe and Break“
While in traditional “scribe and break” the cell is ablatively scribed, in LDC the laser takes over the guidance of the break edge. The local induced voltage of the laser beam allows it to be guided along an almost freely definable line to the opposite cell edge. The solar cell is thus split purely by the voltage generated by the laser beam. This is not only particularly gentle on the material, but also eliminates the need for additional cooling media and suction.
- High speed
- Particle-free operation
- No mechanical separation necessary
- Cost saving
- Time saving
- Avoidance of micro cracks
- Lower cell breakage rate
A look ahead
The fully automated cell cutting solution LDC combines a laser cleaving process with integrated handling automation. Currently, wafers from a size of 158.75 mm pose greater challenges to conventional processes. Using Laser Direct Cleaving, processing up to a wafer size of 210 mm is possible without any problems and with almost no cycle time.
Recommended machine type: LUMION
The LUMION is a state-of-the-art laser system for processing crystalline solar cells. It achieves a throughput of up to 7,500 wafers per hour and is used in industrial manufacturing 24/7. The LUMION is available for various applications, such as Laser Direct Cleaving (LDC), Passivated Backside Contact Opening (PERC)or for Local Doping (LDSE).