Material: Glas

EXPEGO

EXPEGO

The EXPEGO is a laser processing workstation designed for high-precision applications in the electronic and precision engineering industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm. 

DIMENSO

DIMENSO

The DIMENSO is a laser processing system designed for high precision and high speed applications in the photovoltaic and glass industries. The system is designed for selective ablation of thin film layers on large format glass, with the ability to remove layers from the top or through the glass from the bottom. The DIMENSO is […]

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