The LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. This laser system is often used in R&D environments, as well as production of smaller substrates as e.g. ceramic PCBs. The axes of the machine are driven by linear motors. High traversing speed, with at […]
Material: PCB circuit boards
The EXPEGO is a laser processing workstation designed for high-precision applications in the electronic and precision engineering industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.
The DIVIDOS series meets all requirements for laser depaneling of rigid and flexible printed circuit boards and separates different materials extremely fast, stress-free and without residues. In the FULL CUT process (cut without webs), up to 300% more panels can be provided on a PCB and separated in this way, depending on the PCB design. […]