The DIMENSO is a laser processing system designed for high-precision and high-speed applications in the photovoltaic and glass industries. The system is designed for selective ablation of thin film layers on large format glass, with the possibility to remove layers from the top or through the glass from below. The DIMENSO is available with mechanical scribing heads (from the top) or with multiple laser beam heads (from the top or bottom). The system speed is up to 3,000 mm/sec.
DIMENSO
Series – FSS, TTG, LED
LASER SYSTEM FOR PROCESSING GLASS SUBSTRATES FOR THE THIN-FILM PHOTOVOLTAIC AND GLASS INDUSTRY
Performance benefits
- High speed processing with multiple beams for maximum throughput
- Precise structural accuracy based on high-precision image processing systems
- Integrated sensors for automatic compensation of substrate tolerances
- Industry 4.0 capable
- Automatic camera calibration
Options
- InnoLas Postprocessor for CAD data transfer, processing and laser recipe creation
- Extraction system
- MES interface
- Integrated process measurement technology
- On-the-fly focus adjustment
- Processing through the glass or from the top side
- INFINITY Scan to avoid stitching errors while increasing process speed (simultaneous axis and scanner movement)
Technical data
Optics
Fixed optics or galvo scanner
Accuracy
<±10 μm
Repeatability
<±2 μm
Size of substrate
0.5 mm - 4 mm / (coated) glass substrates
Image recognition system
InnoLas μVision
Software
Windows 10; IoT
Plattformtype
Granite-based
Automation
- Customised automation solutions
- Interface to 3rd party automation
Laser processes
- Local structuring / ablation
- P1, P2, P3, P4
- LED (Laser Edge Deletion)
- Laser ablation
- Mechanical scribing / laser scribing / surface modification