DIMENSO

Series – FSS, TTG, LED

LASER SYSTEM FOR PROCESSING GLASS SUBSTRATES FOR THE THIN-FILM PHOTOVOLTAIC AND GLASS INDUSTRY

The DIMENSO is a laser processing system designed for high precision and high speed applications in the photovoltaic and glass industries. The system is designed for selective ablation of thin film layers on large format glass, with the ability to remove layers from the top or through the glass from the bottom. The DIMENSO is available with mechanical scribing heads (from the top) or with multiple laser beam heads (from the top or bottom). The system speed is up to 3,000 mm/sec.

Benefits

  • High speed processing with multiple process heads (beams) for maximum throughput 
  • Precise pattern accuracy based on highly accurate machine vision systems and stages 
  • Integrated metrology for automatic compensation of substrate tolerances 
  • Industry 4.0 ready 
  • Automatic camera calibration 
  • Automated routines for reference runs 
  • Automated vision system 

Options

  • InnoLas Postprocessor for CAD data transfer, processing and laser recipe creation
  • Extraction system
  • MES interface
  • Integrated process measurement technology
  • On-the-fly focus adjustment
  • Mechanical scribing / laser scribing / surface modification
  • Processing through the glass or from the top side
  • INFINITY Scan to avoid stitching errors while increasing process speed (simultaneous axis and scanner movement)

Technical Data

Optic
Fixed optic or galvo scanner

Accuracy
< ±10 μm

Repeatability
< ±2 μm

Substrate Size
2000 x 2500 mm

Thickness/Material
0.5 mm – 4 mm / (coated) glass substrates

Image System
InnoLas μVision

Software
Windows 10 IoT

Platform type
Granite based

Automation

  • Customized automation solutions 
  • Interface to 3rd party automations 
Are you interested in the DIMENSO and their performance benefits?

No matter whether you would like to get basic advice or already have very precise ideas – we will be happy to help you!

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