DIVIDOS

LASER DEPANELING SOLUTION

The DIVIDOS series meets all requirements for laser depaneling of rigid and flexible printed circuit boards and separates different materials extremely fast, stress-free and without residues. In the FULL CUT process (cut without webs), up to 300% more panels can be provided on a PCB and separated in this way, depending on the PCB design. Optionally, using a second galvanometer can up to double the throughput capability of the DIVIDOS. The laser which operates without physical contact and is subject to almost no wear, resulting in extremely low operating costs.

Benefits

  • With FULL CUT process (cut without webs), higher density of panels per printed circuit board 
  • Free cut for complex contours (e.g. circle shapes) 
  • Dedicated solution for PCB depaneling 
  • High edge quality & less residuals 
  • No carbonization  
  • Industry 4.0 ready 
  • Automatic camera calibration 
  • Automated routines for reference runs 
  • Automated vision system for precision alignment & scaling, offset, trapezoidal & rotation compensation 

Options

  • 2nd process head (scanner) 
  • InnoLas Postprocessor for CAD file transfer 
  • Exhaust system 
  • MES Interface 
  • Auto focus 
  • Integrated process metrology 

Technical Data

Optic
High speed Scanner

Axis
X-Y / Z

Accuracy
< ±50 μm

Repeatability
< ±20 μm

Substrate Size
18“ x 18“ (457 x 457 mm)

Material
Rigid & Flex PCB

Image System:
InnoLas μVision

Software
Windows 10 IoT

Automation

  • Fully and semi-automatic InnoLas automation 
  • Customized automation solutions 
  • Stand-alone system & inline integration 
  • SMEMA compatible with 3rd party automation 
Are you interested in the DIVIDOS and their performance benefits?

No matter whether you would like to get basic advice or already have very precise ideas – we will be happy to help you!

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