EXPEGO

HIGH PRECISION LASER MACHINE FOR LARGE SUBSTRATES

The EXPEGO is a laser processing workstation designed for high-precision applications in the electronic and precision engineering industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm. 

Benefits

  • Processing multiple substrates in parallel 
  • Very flexible design with highest degree of customization for various applications 
  • Flexible chuck design 
  • High precise and ultrafast laser system 
  • Industry 4.0 ready 
  • Automatic camera calibration 
  • Automated routines for reference runs 
  • Automated vision system for precision alignment & scaling, offset, trapezoidal & rotation compensation 

Options

  • Up to 3 lasers sources with beam switches 
  • InnoLas Postprocessor for CAD data transfer, processing and laser recipe creation
  • Exhaust system 
  • MES Interface 
  • Auto focus 
  • Integrated process metrology
  • INFINITY Scan to avoid stitching errors while increasing process speed (simultaneous axis & scanner movement)

Technical Data

Optic
Fixed optic or high-speed scanner setup

Axis
X-Y / Z

Accuracy
< ±5 μm abs. (± 0,197 Mils)

Repeatability
< ±2 μm (± 0,079 Mils)

Substrate Size
up to 29.5 x 29.5” (750 mm x 750 mm)

Material
Rigid-, flex-PCBs, ceramic, glass and advanced materials

Image System
InnoLas μVision

Software
Windows 10 IoT

Platform type
Granite based

Automation

  • Fully and semi-automatic InnoLas automation 
  • Customized automation solutions 
  • Standalone system 
  • SMEMA compatible with 3rd party automation 
Are you interested in the EXPEGO and their performance benefits?

No matter whether you would like to get basic advice or already have very precise ideas – we will be happy to help you!

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