High Precision Laser Machine for Large Substrates

The EXPEGO is a laser processing workstation designed for high-precision applications in the electronic and precision engineering industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm. 

Performance benefits

  • Processing multiple substrates in parallel
  • Very flexible design with highest degree of customization for various applications
  • Flexible chuck design
  • High precise and ultrafast laser system
  • Industry 4.0 ready
  • Automatic camera calibration
  • Automated routines for reference runs
  • Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation


  • Up to 3 lasers sources with beam switches
  • InnoLas Postprocessor for CAD file transfer
  • Exhaust system
  • MES Interface
  • Auto focus
  • Integrated process metrology
  • INFINITY Scan to avoid stitching errors while increasing process speed (simultaneous axis and scanner movement)

Technical data

Fixed optic or High Speed Scanner setup

X-Y / Z

< ±5 μm abs. (± 0,197 Mils)

< ±2 μm (± 0,079 Mils)

Substrate Size
Up to 29.5” x 29.5” (750 mm x 750 mm)

Rigid-, flex-PCBs, ceramic, glass and advanced materials

Image System
InnoLas μVision

Windows 10; IoT

Platform type
Granite based


  • Fully and semi-automatic InnoLas Automation
  • Customized automation solutions
  • Stand Alone System
  • SMEMA compatible with 3rd party automation

Laser processes

  • Laser Drilling
  • Laser Depaneling
  • Laser Scribing
  • Laser Ablation
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