The EXPEGO is a laser processing workstation designed for high-precision applications in the electronic and precision engineering industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.
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Benefits
- Processing multiple substrates in parallel
- Very flexible design with highest degree of customization for various applications
- Flexible chuck design
- High precise and ultrafast laser system
- Industry 4.0 ready
- Automatic camera calibration
- Automated routines for reference runs
- Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation
Options
- Up to 3 lasers sources with beam switches
- InnoLas Postprocessor for CAD file transfer
- Exhaust system
- MES Interface
- Auto focus
- Integrated process metrology
- INFINITY Scan to avoid stitching errors while increasing process speed (simultaneous axis and scanner movement)
Technical Data
Optic
Fixed optic or High Speed Scanner setup
Axis
X-Y / Z
Accuracy
< ±5 μm abs. (± 0,197 Mils)
Repeatability
< ±2 μm (± 0,079 Mils)
Substrate Size
Up to 29.5” x 29.5” (750 mm x 750 mm)
Material
Rigid-, flex-PCBs, ceramic, glass and advanced materials
Image System
InnoLas μVision
Software
Windows 10; IoT
Platform type
Granite based
Automation
- Fully and semi-automatic InnoLas Automation
- Customized automation solutions
- Stand Alone System
- SMEMA compatible with 3rd party automation
Laser processes
- Laser Drilling
- Laser Depaneling
- Laser Scribing
- Laser Ablation
Product sheet
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