The ULTAGO is a powerful laser processing workstation designed for high precision applications in the photovoltaic, precision engineering, and electronic industries. This machine platform achieves high throughput with maximum accuracy in the industrial production of solar cells or ceramic substrates. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.
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Benefits
- Overall precision: 10 µm
- Up to 4,000 wafers / hour
- 3-, 5- or even 8-Point alignment methods available (wafer edges or fiducials)
- Indexing table for parallel processing
- Single, or dual scanner setup
- Industry 4.0 ready
- Automatic camera calibration
- Automated routines for reference runs
- Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation
Options
- 4 process heads (single line)
- InnoLas Postprocessor for CAD file transfer
- Exhaust system
- MES Interface
- Auto focus
- Integrated process metrology
- High precision calibration system
Technical Data
Optic
High Speed Scanner
Accuracy
<±5 μm (±0.197 Mils)
Repeatability
<±2 μm (±0.079 Mils)
Substrate Size
M2 up to M6 (166 x 166 mm)
Thickness / Material
0.1 mm - 0.10 mm / cSi wafer, ceramics
Image System
InnoLas μVision
Software
Windows 10; IoT
Platform type
Granite based
Automation
- Fully automatic High Speed Automation from InnoLas Solutions
- Stand Alone and production line integrated systems
- Customized automation solutions
Laser processes
- Laser Drilling
- Laser Scribing
- Laser Cutting
- Laser Ablation
Product sheet
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